溶液温度和衬底对电化学沉积Cu2O薄膜形貌的影响

以透明导电玻璃(TCO)、纳米TiO2/TCO、CNTs/TCO、铜片分别为工作电极,用简单铜盐通过阴极还原制备了Gu2O薄膜,并研究了溶液温度和衬底对电化学沉积Gu2O薄膜形貌的影响.结果表明:以TCO和铜片为衬底时,由于表面微粒为微米级,不管溶液温度高低,只能得到微米级的Cu2O薄膜;以纳米TiO2/TCO和CNTs/TCO为衬底,池温高于30℃只能得到微米级的Cu2O薄膜,而池温降到0℃时,都可得到纳米Cu2O.     

单轴媒质基底上微带贴片的解析渐进提取法

利用解析渐进提取法分析了单轴媒质基底上的微带贴片问题,计算结果表明:和传统方法相比,提出的方法可以提高计算精度的同时,又大大地缩短了计算时间.     

铜基上化学镀锡

研究了化学镀锡工艺,结果表明,随着镀液温度的升高,化学镀锡的沉积速率提高,当温度达到８０℃时,沉积速率最高;若继续升高镀液温度,沉积速率却降低。此外,化学镀锡的沉积速率随化学镀时间的延长而增加。镀液稳定可靠,采用本工艺可得可光亮的锡镀层。     

弹性半空间地基板的求解

将地基板和地基之间的接触分布力视为地基的外力,并将接触分布力进行离散化,依次加载到地基上,利用弹性力学中的叠加原理,推导出了地基中储存的弹性势能公式,建立了地基和地基板体系的势能表达式,并利用最小势能原理求解出了地基和地基板的沉降。推导出的势能公式可作为研究建筑结构与地基共同作用原理的理论基础。     

Study of bending reliability and electrical properties of platinum lines on flexible polyimide substrates

We have experimentally studied the variation in electrical resistance of flexible platinum lines patterned on polyimide foil when they are subjected to circular bending constraints. The lines were patterned by means of standard photolithography and sputtering deposition. Two different photolithography masks were used for comparative evaluation: an un-expensive transparency mask and a standard chromium mask. Measurements of the temperature coefficient of resistance (TCR) and time stability of the resistance have been acquired for lines bent down to 1.25 mm radius of curvature on a customized bending setup, showing good reliability results. The robustness of the lines has been also assessed by registering their change in resistance while bending at different radii of curvature. The lines showed reliability issues for radii of curvature below 1.25 mm, presenting a resistance variation of 19% for transparency mask-fabricated lines and 9% for chromium mask-fabricated lines. The worse reliability performances of transparency mask lines, compared to the chromium mask ones, was found to be due to their imperfect edges, which promoted the formation and propagation of cracks during bending. The results of the experiments in this work permitted to compare the performances of flexible conductive lines with different geometry and fabricated with two different masks, establishing quantitative and qualitative bending limits for their appropriate operation in flexible electronics systems.     

高温高压对PDC硬质合金基体微观结构与性能的影响

采用金相显微镜、SEM、XRD和EDX对合成PDC所用的硬质合金基体在高温高压前后的微观结构和物相进行了分析比较,并对其硬度、密度、矫顽磁力、钴磁和抗弯强度（TRS）分别做了测定,结果表明：（1）经过高温高压后,硬质合金基体中的粗晶WC有轻微的细化;（2）在合成PDC的温度、压力和时间条件下,硬质合金基体的物相没有发生明显变化;（3）高温高压后基体界面附近的钴含量显著降低,但离界面3mm以上区域的钴含量趋于正常;（4）高温高压后硬质合金基体的硬度和密度增加,抗弯强度下降,钴相分布的均匀性变差。     

基于高次模的六边形基片集成波导腔体滤波器

基片集成波导滤波器已被证明具有高Q值、高功率、生产成本低、易于集成等优点。但随着频率的升高，尤其是到达毫米波阶段，其结构尺寸大幅减少的同时给加工制作带来了较大的难度。文中探讨了基于基片集成波导谐振腔的高次模滤波器设计方法，与主模腔体滤波器相比，当结构大小相同时，可实现更高的频率。